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June 01, 2005
Fast Curing Adhesive Has High Thermal Conductivity
A fast curing two component epoxy adhesive with an exceptionally high thermal conductivity.
(PRWEB) June 1, 2005 -- Master Bond Inc., Hackensack, N.J. has introduced Master Bond EP24AN, a fast curing two component epoxy adhesive with an exceptionally high thermal conductivity. It’s thermal conductivity is over 22 BTU/in/ft2/hr/°F. EP24AN also has superior electrical insulation properties. Volume resistivity is >1013 ohm-cm.
This easy to use material has a 1 to 1 non-critical mix ratio weight or volume. It has excellent adhesion to a wide range of similar and dissimilar substrates and can offer a tensile shear strength of over 1,600 psi. EP24AN has an extremely fast cure time at room temperature. Gel times can be obtained in 20 minutes!
Master Bond EP24AN has a low coefficient of thermal expansion, low shrinkage and superb dimensional stability. It has outstanding thermal shock and chemical resistance. EP24AN is available in 1/2 pint, pint, quart, gallon and 5 gallon kits.
For further information, please contact our Technical Support Department.
USA & Canada
Phone: 201-343-8983
Fax: 201-343-2132
E-mail: e-mail protected from spam bots
Asia, Central and South
America Western U.S
and Western Canada
Phone: 818-793-5605
Fax: 201-696-9031
Email: e-mail protected from spam bots
Eastern and Western
Europe and Africa
Phone:+44-207-039-0034
Fax: +44-207-060-0628
E-mail: e-mail protected from spam bots
Middle East
Phone: 972-2-652-8384
Fax: 972-2-652-8402
E-mail: e-mail protected from spam bots
Posted by Industrial-Manufacturing at June 1, 2005 02:03 AM